1. Descaler & Cleaner (Pre-treatment)
The descaler and cleaner are designed for pre-treatment application in semiconductor and connector industries. These products are chloride free and provide good adhesion to achieve high performance in electroplating.
2. Plating Chemicals
The leadframe plating additives are specially designed to enhance the plating performance in different plating systems .
3. Neutralizers (Post-treatment)
These products serve to protect the plated product surface and prevent discoloration without compromising on solderability.
4. Strippers (Post-treatment)
Pre-Treatment, Immersion / Soak Cleaner
| Product | Immersion Time | Operating Temperature | Characteristics |
|---|
| Copper Etchant |
20 ~ 90 Seconds |
25 ~ 40 ° C |
- Removes oxides and micro-etch the surface
- Suitable for different substrate including Olin 7025
- Available in liquid and powder form
|
| HS 42 Descaler |
30 ~ 90 Seconds |
25 ~ 40 ° C |
- Specifically for Alloy 42 leadframes
- Simple and only one step
|
Pre-Treatment, Electrolytic Cleaner
| Product | Base of Electrolyte | Immersion Time | Operating Temperature | Current Density | Characteristics |
|---|
| PyraClean ECH 1000 P |
Sodium Hydroxide |
5 ~ 30 Seconds |
55 ~ 65 ° C |
5 ~ 25 ASD (Cathodic)
1 ~ 30 ASD (Anodic)
|
- Available in Powder & Liquid form
- Can be used in cathodic, anodic, bipolar or immersion operations
- Suitable for the use with copper and nickel-alloy substrate
- Sillicate free process to provide excellent adhesion and uniform coverage
- Suitable for Leadframes, PCB's and Connectors
|
Plating Chemicals
| Product | Base of Electrolyte | Operating Temperature | Current Density | Application | Characteristics |
|---|
| High Speed Silver Plating |
Alkaline Phosphate Cyanide |
20 ~ 65 ° C |
20 ~ 350 ASD |
Lead Frame Connector / LED and Semiconductor |
- Uniform smooth finish matte to semi-bright
- High throwing power
- Nodule free deposition
- Simple periodic maintenance
|
| Low Speed Silver Plating |
Alkaline Carboxylate |
25 ° C |
Volatage Control < 2.0 V |
General Metal Finishing |
- Non-cyanide semi-bright
- Stable
- Environment and user friendly
|
| Tinlux (HSTP) |
Methane Sulfonic Acid (MSA) |
25 ~ 35 ° C |
4 ~ 20 ASD |
High speed Lead Frame / Connector Plating |
- Matte, fine grained, smooth, pure tin
- Stable and uniform thickness distribution
- Lead-free process
- Excellent Solderability
- Whisker Free
|
| Solderlux (Sn/Pb) |
Methane Sulfonic Acid (MSA) |
25 ~ 35 ° C |
4 ~ 20 ASD |
High speed Lead Frame / Connector Plating |
- Fine grained, smooth and matte deposit
- Stable alloy and uniform thickness deposit
- Excellent Solderability
- Whisker Free
- Good for 90:10 (Sn:Pb) Plating
|
| Satin 108 |
Sulphuric Acid (H2SO4) |
25 ~ 35 ° C |
0.5 ~ 4.0 ASD |
Rack Plating / PCB |
- 'Snow-white', matte, fine grained, smooth pure tin
- Uniform thickness distribution
- Excellent solderability
- Whisker free
- Suitable for low volume plating lines
|
Post-Treatment, Neutralizers
| Product | Immersion Time | Operating Temperature | Characteristics |
|---|
| TSP Neutralizer |
15 ~ 60 Seconds |
40 ~ 60 ° C |
- To neutralize acid from tin and solder plating (with phosphate contents)
- Available as per customer requirements also
|
| Neutralizer PF |
15 ~ 60 Seconds |
40 ~ 60 ° C |
- Phosphate free
- Organic based complexing chemical
|
| Pyrarinse 95 |
2 ~ 20 Seconds |
40 ~ 70 ° C |
- Water based solution and phosphate free
- Neutralizing the acidic film and residues of additives and plating electrolytes
- Operates at moderate alkaline pH (About 9.5)
|
| PyraACT 110 |
5 ~ 25 Seconds |
20 ~ 40 ° C |
- Acidic
- Anti-tarnish to enhance solderability
|
| Pyraclean-ECH 1002 |
5 ~ 30 Seconds |
55 ~ 65 ° C |
- Post electro-clean for silver plating, and also PCB applications
- Sillicate free to provide excellent adhesion and bondability
- Can be used in electrolytic and immersion process
|
Post-Treatment, Strippers
| Product | Operating Temperature | Voltage | Average Stripping Rate | Characteristics |
|---|
| HS Solder Stripper |
25 ~ 40 ° C |
NA |
20 µm / min |
- Immersion Process, Tin (Sn) Stripper
- Suitable for high speed plating lines
- Nitric Acid (HNO3) based
|
| Pyra Strip (Au) Concentrate |
20 ~ 40 ° C |
NA |
4 ~ 6 µm / min |
- Suitable for PCB's also
- No discoloration of substrate after stripping gold
- High yet adjustable stripping speed
- Safer as it requires lesser potassium cyanide (15g/L)
|
| Pyra-E-Strip Sn |
Room Temperature |
< 1.5 Volts |
8 ~ 10 µm / min at 20A / dm2 |
- Belt type Electrolytic Stripper
- Acidic, non-fluoride water based solution
- Low metal concentrations in the electrolyte
- Limited sludge formation
- Negligible attack on Carrier Belt
- Doesn't create strong passivated stainless-steel surface that causes easy activation and avoids adhesion problems
- Suitable for stainless steel and copper based alloy carrier belt
|
| Non-CN Silver Stripper |
Room Temperature |
4 ~ 7 Volts |
4.5 ~ 6.5 µm / min |
- Suitable for PCB manufacturing applications
- Non cyanide electrolytic process
- No discoloration of substrate after stripping
- Easier and safer disposal of waste solution
|
| Silver Stripper Ag81 |
Room Temperature |
NA |
0.5 ~ 1 µm / min |
- Non cyanide immersion process
- Fast and effective action
- Safe and easy to use
- Chloride free
- Suitable for all types of copper lead frame material
|
| TL86 Rework Stripper |
Room Temperature |
NA |
5 0 µm / min |
- Acid based stripper for tin and tin-lead deposits
- Chloride free
- Suitable for all lead frame material
- No pre-mixing is required
|
| Aqua NickStrip |
20 ~ 35 ° C |
NA |
0.5 ~ 1 µm / min |
- Protects the brightness of the copper
- For Nickel stripping on a wide range of substrate such as copper, titanium and stainless steel
|
