1. Descaler & Cleaner (Pre-treatment)
The descaler and cleaner are designed for pre-treatment application in semiconductor and connector industries. These products are chloride free and provide good adhesion to achieve high performance in electroplating.
2. Plating Chemicals
The leadframe plating additives are specially designed to enhance the plating performance in different plating systems.
3. Neutralizers (Post-treatment)
These products serve to protect the plated product surface and prevent discoloration without compromising on solderability.
4. Strippers (Post-treatment)
Pre-Treatment, Immersion / Soak Cleaner
Product | Immersion Time | Operating Temperature | Characteristics |
---|---|---|---|
Copper Etchant | 20 ~ 90 Seconds | 25 ~ 40 ° C |
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HS 42 Descaler | 30 ~ 90 Seconds | 25 ~ 40 ° C |
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Pre-Treatment, Electrolytic Cleaner
Product | Base of Electrolyte | Immersion Time | Operating Temperature | Current Density | Characteristics |
---|---|---|---|---|---|
PyraClean ECH 1000 P | Sodium Hydroxide | 5 ~ 30 Seconds | 55 ~ 65 ° C |
5 ~ 25 ASD (Cathodic) 1 ~ 30 ASD (Anodic) |
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Plating Chemicals
Product | Base of Electrolyte | Operating Temperature | Current Density | Application | Characteristics |
---|---|---|---|---|---|
High Speed Silver Plating | Alkaline Phosphate Cyanide | 20 ~ 65 ° C | 20 ~ 350 ASD | Lead Frame Connector / LED and Semiconductor |
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Low Speed Silver Plating | Alkaline Carboxylate | 25 ° C | Volatage Control < 2.0 V | General Metal Finishing |
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Tinlux (HSTP) | Methane Sulfonic Acid (MSA) | 25 ~ 35 ° C | 4 ~ 20 ASD | High speed Lead Frame / Connector Plating |
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Solderlux (Sn/Pb) | Methane Sulfonic Acid (MSA) | 25 ~ 35 ° C | 4 ~ 20 ASD | High speed Lead Frame / Connector Plating |
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Satin 108 | Sulphuric Acid (H2SO4) | 25 ~ 35 ° C | 0.5 ~ 4.0 ASD | Rack Plating / PCB |
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Post-Treatment, Neutralizers
Product | Immersion Time | Operating Temperature | Characteristics |
---|---|---|---|
TSP Neutralizer | 15 ~ 60 Seconds | 40 ~ 60 ° C |
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Neutralizer PF | 15 ~ 60 Seconds | 40 ~ 60 ° C |
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Pyrarinse 95 | 2 ~ 20 Seconds | 40 ~ 70 ° C |
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PyraACT 110 | 5 ~ 25 Seconds | 20 ~ 40 ° C |
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Pyraclean-ECH 1002 | 5 ~ 30 Seconds | 55 ~ 65 ° C |
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Post-Treatment, Strippers
Product | Operating Temperature | Voltage | Average Stripping Rate | Characteristics |
---|---|---|---|---|
HS Solder Stripper | 25 ~ 40 ° C | NA | 20 µm / min |
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Pyra Strip (Au) Concentrate | 20 ~ 40 ° C | NA | 4 ~ 6 µm / min |
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Pyra-E-Strip Sn | Room Temperature | < 1.5 Volts | 8 ~ 10 µm / min at 20A / dm2 |
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Non-CN Silver Stripper | Room Temperature | 4 ~ 7 Volts | 4.5 ~ 6.5 µm / min |
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Silver Stripper Ag81 | Room Temperature | NA | 0.5 ~ 1 µm / min |
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TL86 Rework Stripper | Room Temperature | NA | 5 0 µm / min |
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Aqua NickStrip | 20 ~ 35 ° C | NA | 0.5 ~ 1 µm / min |
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