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1.  Descaler & Cleaner (Pre-treatment)
The descaler and cleaner are designed for pre-treatment application in semiconductor and connector industries. These products are chloride free and provide good adhesion to achieve high performance in electroplating.

2.  Plating Chemicals
The leadframe plating additives are specially designed to enhance the plating performance in different plating systems .

3.  Neutralizers (Post-treatment)
These products serve to protect the plated product surface and prevent discoloration without compromising on solderability.

4.  Strippers (Post-treatment)   

Pre-Treatment, Immersion / Soak Cleaner

Pre-Treatment, Immersion / Soak Cleaner

ProductImmersion TimeOperating TemperatureCharacteristics
Copper Etchant 20 ~ 90 Seconds 25 ~ 40 ° C
  • Removes oxides and micro-etch the surface
  • Suitable for different substrate including Olin 7025
  • Available in liquid and powder form
HS 42 Descaler 30 ~ 90 Seconds 25 ~ 40 ° C
  • Specifically for Alloy 42 leadframes
  • Simple and only one step

Pre-Treatment, Electrolytic Cleaner

ProductBase of ElectrolyteImmersion TimeOperating TemperatureCurrent DensityCharacteristics
PyraClean ECH 1000 P Sodium Hydroxide 5 ~ 30 Seconds 55 ~ 65 ° C

5 ~ 25 ASD (Cathodic)

1 ~ 30 ASD (Anodic)

  • Available in Powder & Liquid form
  • Can be used in cathodic, anodic, bipolar or immersion operations
  • Suitable for the use with copper and nickel-alloy substrate
  • Sillicate free process to provide excellent adhesion and uniform coverage
  • Suitable for Leadframes, PCB's and Connectors

Plating Chemicals

Plating Chemicals

ProductBase of ElectrolyteOperating TemperatureCurrent DensityApplicationCharacteristics
High Speed Silver Plating Alkaline Phosphate Cyanide 20 ~ 65 ° C 20 ~ 350 ASD Lead Frame Connector / LED and Semiconductor
  • Uniform smooth finish matte to semi-bright
  • High throwing power
  • Nodule free deposition
  • Simple periodic maintenance
Low Speed Silver Plating Alkaline Carboxylate 25 ° C Volatage Control < 2.0 V General Metal Finishing
  • Non-cyanide semi-bright
  • Stable
  • Environment and user friendly
Tinlux (HSTP) Methane Sulfonic Acid (MSA) 25 ~ 35 ° C 4 ~ 20 ASD High speed Lead Frame / Connector Plating
  • Matte, fine grained, smooth, pure tin
  • Stable and uniform thickness distribution
  • Lead-free process
  • Excellent Solderability
  • Whisker Free
Solderlux (Sn/Pb) Methane Sulfonic Acid (MSA) 25 ~ 35 ° C 4 ~ 20 ASD High speed Lead Frame / Connector Plating
  • Fine grained, smooth and matte deposit
  • Stable alloy and uniform thickness deposit
  • Excellent Solderability
  • Whisker Free
  • Good for 90:10 (Sn:Pb) Plating
Satin 108 Sulphuric Acid (H2SO4) 25 ~ 35 ° C 0.5 ~ 4.0 ASD Rack Plating / PCB
  • 'Snow-white', matte, fine grained, smooth pure tin
  • Uniform thickness distribution
  • Excellent solderability
  • Whisker free
  • Suitable for low volume plating lines

Post-Treatment, Neutralizers

ProductImmersion TimeOperating TemperatureCharacteristics
TSP Neutralizer 15 ~ 60 Seconds 40 ~ 60 ° C
  • To neutralize acid from tin and solder plating (with phosphate contents)
  • Available as per customer requirements also
Neutralizer PF 15 ~ 60 Seconds 40 ~ 60 ° C
  • Phosphate free
  • Organic based complexing chemical
Pyrarinse 95 2 ~ 20 Seconds 40 ~ 70 ° C
  • Water based solution and phosphate free
  • Neutralizing the acidic film and residues of additives and plating electrolytes
  • Operates at moderate alkaline pH (About 9.5)
PyraACT 110 5 ~ 25 Seconds 20 ~ 40 ° C
  • Acidic
  • Anti-tarnish to enhance solderability
Pyraclean-ECH 1002 5 ~ 30 Seconds 55 ~ 65 ° C
  • Post electro-clean for silver plating, and also PCB applications
  • Sillicate free to provide excellent adhesion and bondability
  • Can be used in electrolytic and immersion process

Post-Treatment, Strippers

Post-Treatment, Strippers

ProductOperating TemperatureVoltageAverage Stripping RateCharacteristics
HS Solder Stripper 25 ~ 40 ° C NA 20 µm / min
  • Immersion Process, Tin (Sn) Stripper
  • Suitable for high speed plating lines
  • Nitric Acid (HNO3) based
Pyra Strip (Au) Concentrate 20 ~ 40 ° C NA 4 ~ 6 µm / min
  • Suitable for PCB's also
  • No discoloration of substrate after stripping gold
  • High yet adjustable stripping speed
  • Safer as it requires lesser potassium cyanide (15g/L)
Pyra-E-Strip Sn Room Temperature < 1.5 Volts 8 ~ 10 µm / min at 20A / dm2
  • Belt type Electrolytic Stripper
  • Acidic, non-fluoride water based solution
  • Low metal concentrations in the electrolyte
  • Limited sludge formation
  • Negligible attack on Carrier Belt
  • Doesn't create strong passivated stainless-steel surface that causes easy activation and avoids adhesion problems
  • Suitable for stainless steel and copper based alloy carrier belt
Non-CN Silver Stripper Room Temperature 4 ~ 7 Volts 4.5 ~ 6.5 µm / min
  • Suitable for PCB manufacturing applications
  • Non cyanide electrolytic process
  • No discoloration of substrate after stripping
  • Easier and safer disposal of waste solution
Silver Stripper Ag81 Room Temperature NA 0.5 ~ 1 µm / min
  • Non cyanide immersion process
  • Fast and effective action
  • Safe and easy to use
  • Chloride free
  • Suitable for all types of copper lead frame material
TL86 Rework Stripper Room Temperature NA 5 0 µm / min
  • Acid based stripper for tin and tin-lead deposits
  • Chloride free
  • Suitable for all lead frame material
  • No pre-mixing is required
Aqua NickStrip 20 ~ 35 ° C NA 0.5 ~ 1 µm / min
  • Protects the brightness of the copper
  • For Nickel stripping on a wide range of substrate such as copper, titanium and stainless steel