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Electro and Chemical Deflash

These products are specifically designed to soften or loosen the resin bleed and mold flashes from the leadframe. Their compositions allow for effective deflashing with no discoloration on the molded package body.

 

 

Electro-Deflash

ProductImmersion TimeOperating TemperaturepHWater Jet PressureCharacteristics
EDF 889 30 ~ 90 Seconds 40 ~ 80 ° C 6 ~ 8 50 ~ 500 Bar
  • Chloride Free
  • Water Based
EDF 2000 45 ~ 90 Seconds 45 ~ 60 ° C 7 ~ 9 50 ~ 500 Bar
  • Halogen Free
  • Water Based
EDF 4000 45 ~ 90 Seconds 50 ~ 70 ° C > 12 50 ~ 500 Bar
  • Halogen and Phosphate Free
  • Water Based

Chemical-Deflash

ProductImmersion TimeOperating TemperaturepHWater Jet PressureCharacteristics
CD 888 45 ~ 60 Minutes 90 ~ 100 ° C 11 ~ 13 50 ~ 500 Bar
  • Chloride Free
  • Non-flammable
  • Water based
  • Suitable for alloy 42, copper and Nickel based substrates
CD 6000 20 ~ 40 Minutes 50 ~ 80 ° C > 12 50 ~ 500 Bar
  • Halogen and Phosphate Free
  • Suitable for copper and Nickel based substrates
  • Water based
CD 8000 20 ~ 40 Minutes 70 ~ 85 ° C > 12 50 ~ 500 Bar
  • Halogen and Phosphate Free
  • Suitable for copper and Nickel based substrates
  • Solvent based